The Technology Programme led by the UK Department of Trade and Industry (DTI) is supporting a new initiative to develop high temperature electronics packaging solutions for down-well and aero engine applications.
The Uptemp project has been formed with support from a £192,000 grant from the Technology Programme. The project brings together Oxford University’s Materials Department, funded directly by the Engineering and Physical Sciences Research Council, with a consortium of end-users.
The consortium consists of Sondex Wireline, Vibro-Meter UK, Micro Circuit Engineering and materials suppliers Thermastrate and Gwent Electronic Materials.
The project programme includes reliability analysis of the materials and processes.
DTI supports new initiative
Top Stories
You may also like
Stiebel Eltron announces expansion to Ireland with new Dublin HQ
February 15, 2024
Greater Manchester set to become a test bed for green energy projects
February 15, 2024