The Technology Programme led by the UK Department of Trade and Industry (DTI) is supporting a new initiative to develop high temperature electronics packaging solutions for down-well and aero engine applications.
The Uptemp project has been formed with support from a £192,000 grant from the Technology Programme. The project brings together Oxford University’s Materials Department, funded directly by the Engineering and Physical Sciences Research Council, with a consortium of end-users.
The consortium consists of Sondex Wireline, Vibro-Meter UK, Micro Circuit Engineering and materials suppliers Thermastrate and Gwent Electronic Materials.
The project programme includes reliability analysis of the materials and processes.
DTI supports new initiative
